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Global assignements
I trying to get Quartus to acknowledge the dual FFs I have implemented for CDC, and is seems like my assignments have been accepted But, when running compilation I get these warnings But, in the compilation report / Fitter / Ignored assignments section they are not mentioned. What can be the cause of this?Solved5Views0likes1CommentWhere to place custom .xml flash device files for Quartus Programmer?
Hello, to use flash devices that are not natively supported by Quartus programmer, a .xml device file (pgm_flash_xxxx.xml) describing the programming algorithm must be supplied along with the programming file, e.g. .jic. During code development, the .xml file is usually hold in project folder or a dedicated custom database location. But during initial device programming or reprogramming by field service, we don't have a Quartus project, just a programming file and a standalone Programmer installation, accompanied by said .xml file for non-standard devices. It would be good when .jic file location is checked for .xml file by Quartus Programmer, but that apparently isn't the case. Placing custom .xml file in programmer/xml folder (either <Quartus base directory>/devices/programmer/xml for newer Quartus Pro versions or <Quartus base directory>/quartus/common/devinfo/programmer/xml for Quartus Standard and older Quartus Pro) seems to work, is there a better option? Can we specify a custom database location for Quartus Programmer? Regards Frank23Views0likes4CommentsCyclone 10LP + EPCQ64A config flash corruption during power OFF
Hello, FPGA: 10CL120YF780C8G Flash: EPCQ64A (it holds an initial FW and later on we switch to an operational FW) Problem: Our operational FW used these settings: I was doing power cycling tests. I saw that sometimes (in 15-30 power cycles) flash data gets corrupted. 1-2 bytes are overwritten with 0x00h. If the corrupted section is in the initial FW region, then board becomes a brick and requires JTAG download of the initial FW again. If the corruption occurs at the operational FW section, then operational FW switching does not work and redownload is needed. We confirmed this by reading back the flash data, and doing hex comparison. Here is one example where one byte in the initial FW section became 0xF8 --> 0x00 which made the board completely not working until the JTAG reprogramming. Corrupted byte address it mostly the same across failures. So the actual corruption location did not appear to be random. Signal integrity, power supplies are checked to be OK This failure does not happen in all the boards we have. But we could not identify a HW issue as the boards operate normally, power supplies are OK and signal integrity are OK. When flash signals are probed, the issue did not happen, pushing me to think that something really on the edge is happening realted to timings etc. Solution we found: Checking with a different operational FW and setting the pins as regular IO after configuration fixed the issue This is tested for 300 cycles and it works Scope measurements: I see a clear difference in behavior between two pin assignment cases. During power OFF, original dpf is trying to communicate with the flash, but “REGULAR IO” dpf does not do that. Support request: As we see this issue happens sometimes, and not on all boards, I think we are exciting an edge case. I could not see a HW difference which can cause this behavior. I know that 0x05h is a valid command to the flash, and if it shifts by one bit it can become 0x02h which is a byte write command. I suspect that sometimes this happens during power OFF and we really write to the flash and corrupt it. I think the clear behavior difference during power off is a strong clue. Could you explain why different assignments cause this behavior difference?50Views0likes5CommentsProblems with registered computers in SSLC
Hello, I recently logged in to the Altera SSLC to renew a license. I used to have multiple host computers registered, which now seem to be missing: (None appear either when opening the "View All Computers" window) So I tried to re-create the computer that is to host said license, and I came upon the following error: It would seem that the computer both exists and does not exist! For the sake of seriousness and good taste, I will abstain from making any jokes about Schrödinger and quantum superposition. In any case, I see some maintenance is going on today, so that might be related to the issue. Otherwise, I would greatly appreciate if this could be looked into. Thank you and regards, NoahClock domain crossing?
I two vectors crossing from 150MHz-domain to 120MHz-domain, and the design assistant lists violations according to rule D101. I do not understand why only valid-bits for some of the channels get these violations. And, why the data-buses seems to be fine. The vectors are actually 16 channels of data/valid busses. Every channel is prolonged to a 2x clock in the 150MHz domain, and then synchronized through dual FFs in the 120MHz domain. I have tried forcing Quartus by adding these global assignments I have also added these attributes in my source code. The technology-viewer still shows a LOGIC_CELL_COMB between *_s1[0].tvalid and *_s2[0].tvalid, shouldn't there be a direct connection between the two FFs? I am stuck understanding why this occurs. Any suggestions on what can be done?2Views0likes0CommentsAbout Single Event Upset (SEU)
The target devices are MAX 10, Cyclone 10 LP, Cyclone V, and Agilex 3. I would like to confirm the details about SEU for these devices. Question 1: Please explain how the FIT value shown in the "Projected SEU FIT" report for a project in Quartus is calculated. We are being asked, “What is the basis and condition under which this number is derived?” Since our competitors provide this information, we would like Altera to present it as well. I have the following publicly available documents, but since they do not mention any specific calculation formulas, we are making this inquiry. https://docs.altera.com/r/docs/683869/current/an-866-mitigating-and-debugging-single-event-upsets-in-quartus-prime-standard-edition/quartus-prime-software-seu-fit-reports Question 2: Please provide information on the device structure and supporting data (numerical values) regarding SEU tolerance. Since both AMD (Xilinx) and Lattice have disclosed such information, we would like Altera to present it as well. Best Regards64Views0likes9Comments[Arria 10 SoC] QSPI Flash GigaDevice Compatibility (GD55LB02GE / GD55LB02GF)
Hi Altera Community Support Team, We are currently using the Micron MT25QU02G as the primary QSPI boot device for our Arria 10 SoC (HPS) board. However, due to a severe unit price increase (nearly 20x), we are urgently looking for a cost-effective alternative QSPI Flash memory. During our search, we identified GigaDevice NOR Flash products as potential replacements. However, checking the "Supported Flash Devices for Arria 10 SoC Device" configuration page, GigaDevice is not listed under the Arria 10 SoC section, even though GigaDevice parts are mentioned as supported/compatible for several other FPGA/SoC device families. https://www.altera.com/developers/configuration I would like to ask the following questions: Arria 10 SoC Compatibility: Does the Arria 10 SoC HPS BootROM support booting from GigaDevice 2Gb 1.8V QSPI Flash devices? Since the BootROM operates using standard JEDEC SFDP and basic SPI opcodes, can we expect it to load the preloader/U-Boot SPL without issue? GD55LB02GE vs. GD55LB02GF: Our target part was initially the GD55LB02GE, but we found that it is becoming NR (Not Recommended) / NRND, and the newer generation revision GD55LB02GF is being recommended for new designs. Are both GD55LB02GE and GD55LB02GF supported as boot devices for Arria 10 SoC? Are there any known issues with JEDEC ID parsing or SFDP compatibility in U-Boot / HPS Flash Programmer for the newer F-revision? Programming Tooling: Will quartus_hps or the HPS Flash Programmer support flashing these GigaDevice parts directly, or would we need to handle programming via U-Boot / JTAG scripts? Any advice, official guidance, or experience regarding GigaDevice QSPI Flash migration on Arria 10 SoC would be greatly appreciated.13Views1like3CommentsStratix 10 E-tile Hard IP for Ethernet, 10GE with external AIB clocking error
**Product:** Stratix 10 TX (E-tile), Quartus Prime Pro 26.1.0 Build 110. IP: E-Tile Hard IP for Ethernet, core variant "100GE or 1 to 4 10GE/25GE with optional RSFEC and 1588 PTP", 1 channel, active 25GE, MAC + PCS, RS-FEC off, PTP off, AN/LT off, external AIB clocking on, "Enable custom rate" on (also seen without it). ## Set-up - External AIB clocking as in the 10G/25G dynamic reconfiguration design example: E-tile Native PHY in PLL mode (refclk 156.25 MHz) gives i_aib_2x_clk = 805.66 MHz and i_aib_clk = 402.83 MHz; i_sl_clk_tx / i_sl_clk_rx = i_aib_clk at both rates. - 25G <-> 10G switching with the sequence of the example's c3_reconfig.c (TX/RX ratio attributes 0x0005/0x0006 = 0xA5 / 0x42, Ethernet registers 0x40B / 0x37A / 0x37B, width 0x0014 = 0x55, phase slip 0x000E, PMA enable, RX initial adaptation high effort). - Client: Avalon-ST, ready latency 0, 64-byte frames, about 9.5 M frames/s per direction at 10G. Two channels on the same tile linked through SFP28 modules and fibre. ## Results - **25GE: no errors** (tens of millions of frames, MAC FCSERR 0; timed replay of 17,562 frames bit-exact). - **10GE, RX FCS errors (MAC RX statistics):** | Configuration at 10G | One direction | Full duplex | Internal serial loopback | |---|---|---|---| | TXMAC_EHIP_CFG flowreg_rate = 4, i_sl_custom_cadence = 0 (design-example setting) | 5.1 % | 0.7 / 0.8 % | -- | | flowreg_rate = 7, i_sl_custom_cadence = 64 of 165 cycles (156.25 / 402.83 MHz) | 4.0-4.2 % | 0.5-1.6 % | 0.74 % | | flowreg_rate = 7, cadence 2 of 5 (161.13 / 402.83 MHz) | 10 %, 3.2 % of frames lost | 1.3-8 % | -- | | flowreg_rate = 7, cadence 60 or 62 of 165 | -- | 2-3 %, RX counts more frames than sent | -- | - The error rate is repeatable (4.0-4.2 % over six TX datapath resets) and lower when the receiving channel is also transmitting. - TX FIFO overflow / underflow (o_sl_txfifo_overflow / underflow) are seen on the transmitting channel. Using o_sl_txfifo_pfull / pempty to modulate the cadence made no difference. - **PMA PRBS31 at 10.3125 Gbps (hard PRBS generator / checker, attributes 0x0002 / 0x0003 / 0x0017 / 0x0018 / 0x001A): 0 errors** in internal serial loopback (20 s) and over the fibre in both directions (30 s, > 3e11 bits each). The checker reads 0xFFFFFFFF with non-PRBS input. ## Questions 1. Is 10GE with external AIB clocking and a 402.83 MHz client clock supported without frame errors? What TXMAC_EHIP_CFG flowreg_rate value and i_sl_custom_cadence pattern are required? 2. Are other EHIP, PCS or AIB registers (TX / RX FIFO thresholds, AIB adapter settings) required at 10G with external AIB clocking, beyond those in c3_reconfig.c? 3. If not supported, what is the recommended clocking for run-time 10G <-> 25G switching with the Ethernet hard IP? Our earlier attempt with o_clk_pll_div64 driving i_sl_clk_tx / rx stopped the Avalon-MM register interfaces while the line rate was changed.2Views0likes2Comments
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Aerospace, defense, and high reliability systems must deliver demanding processing performance while operating in environments where extreme temperatures and mechanical stress can compromise electronics. Developers must also plan for long service lives, supply continuity, and mission requirements that continue to evolve. Altera’s defense-grade Agilex FPGA and SoC FPGA portfolio brings these priorities together. It combines scalable programmable performance with military-temperature and ruggedized packaging options, while U.S. wafer fabrication supports supply resilience. For system designers, that means more ways to balance performance, deployment conditions, and long-term program needs. Designed for harsh environments Defense-grade Agilex devices offer military-temperature options supporting operation from −55°C to +125°C, helping designers target extreme hot and cold environments in applications such as outdoor radar, vehicle-mounted communications, and airborne sensors. A wider specified temperature range can provide more thermal headroom and may reduce heating or cooling needed solely to keep a narrower-rated FPGA within its specified limits, easing size, weight, and power trade-offs. Ruggedized packaging options, including leaded-ball configurations, help address temperature cycling, vibration, and shock in mobile and deployed systems. For customers with tin-lead assembly requirements, leaded-ball options can also avoid a separate reballing step and its associated process-control and qualification burden. Addressing environmental durability and manufacturing compatibility early can reduce the risk of late-stage redesign. Together, these capabilities help designers bring Agilex FPGA performance into demanding mission environments with fewer thermal and manufacturing workarounds. Temperature grades and packaging options vary by device and configuration. Supply resilience for long-life platforms Aerospace and defense platforms often remain in service for many years, making continuity of supply an important consideration. Agilex FPGAs provide a domestic source of wafer fabrication that supports supply resilience and helps customers plan for long program lifecycles. Performance and choice across Hi-Rel applications Defense applications call for different combinations of performance, power efficiency, and integration. The Agilex portfolio spans low-power, cost-optimized Agilex 3 FPGAs, mid-range Agilex 5, high-performance Agilex 7, and Agilex 9 Direct RF-Series FPGAs. This range supports applications from embedded processing for industrial and automotive to high-bandwidth communications, radar, and electronic warfare. Altera’s HyperFlex® architecture supports higher clock frequencies and processing throughput through Hyper-Retiming and Hyper-Pipelining. Alongside FPGA programmability, these capabilities offer a flexible foundation as mission-critical systems integrate more sensing, processing, and AI within constrained platforms. Availability Initial shipments of defense-grade Agilex FPGAs are planned for the first quarter of 2027, with software support targeted for Quartus® Prime Design Software version 27.1. For more information about defense-grade device options, contact your local Altera sales representative.
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Meet QuartusIQ Quartus® Prime (Pro Edition, 26.3) introduces the QuartusIQ AI Expert Companion, bringing FPGA expertise and project-aware AI assistance directly into your design workflow. Get guidance where you work, explore design decisions, and connect knowledge with hands-on tasks. Alongside new capabilities in system design, power analysis, and embedded development, QuartusIQ creates a more connected FPGA development experience. QuartusIQ: FPGA Expertise, Closer to Your Design QuartusIQ integrates AI assistance directly into the Quartus GUI, providing access to FPGA knowledge and project-aware guidance within your design environment. You can ask questions, explore design recommendations, and find relevant information without leaving Quartus. QuartusIQ connects to supported LLM providers using your own API key. Beyond general-purpose AI assistance, QuartusIQ combines FPGA-specific knowledge with project summaries to help make questions and recommendations more relevant to your design. Whether you're learning a new tool in Quartus, looking for documentation, or investigating approaches to design closure, this context can help you identify useful next steps. QuartusIQ also supports practical programming and configuration tasks. Analyze and convert programming files, discover connected hardware, and program devices through JTAG. Supports Secure Device Manager (SDM) commands, QSPI compatibility checks, and Remote System Update (RSU) image generation, extending these capabilities to additional device-configuration tasks. For teams exploring AI-assisted development beyond the Quartus GUI, Model Context Protocol (MCP) integration makes QuartusIQ expertise accessible to external AI workflows. And there is also an extension for Visual Studio Code that lets QuartusIQ work with GitHub Copilot. MCP integration and agent capabilities are available, providing additional ways to incorporate FPGA-specific knowledge and tools into connected development environments. Together, these capabilities make QuartusIQ a companion for finding information, understanding your project, and completing tasks, with recommendations you can review and apply to your design. Visual Designer Studio: Keep the System in View Visual Designer Studio (VDS) expands Platform Designer system import to include generic components and parameterized RTL, allowing more of your existing design to be incorporated into a visual workflow. Cross-probing between VDS and other Quartus applications makes it easier to navigate between the system-level view and related design information. Clock/reset fanout simplifies logical hierarchies. Improved separation of source and generated files makes revision control easier to manage. Expanded support for Arria 10, Cyclone 10 GX, and Stratix 10 devices provide greater design flexibility. Board awareness (beta) introduces board-package creation and use within VDS, adding board-level context to the system-design environment. Power & Thermal Analyzer: Streamline Power Analysis Workflows Power analysis is most valuable when it's integrated into the design process. With Tcl scripting and example scripts, Power & Thermal Analyzer makes it easier to automate analysis workflows, maintain consistency, and reassess power consumption as designs evolve. Several usability enhancements simplify working with device resources and analysis results. Device-aware resource filtering and controls help prevent invalid actions, while improved device selection, graphical displays, and numeric alignment make the interface easier to navigate. Common power-analysis reports are now available in the Report Database, providing access to power-analysis results within a familiar reporting environment. HPS is also modeled as a resource rather than a global setting, making its treatment more consistent with other design resources. Embedded Development: Expanded Platform Support and Design Examples Quartus Prime (Pro Edition, 26.3) expands embedded development support with the following: Initial Agilex® 27 SoC Hard Processor System (HPS) enablement, including Simics support and baseline hardware and software reference designs. For Agilex 5 E-Series devices, expanded FreeRTOS support includes Cortex-A76 symmetric multiprocessing (SMP) capabilities, along with the re-release of the bare-metal library. New Agilex 5 E-Series design examples help developers explore a wider range of embedded architectures. These include heterogeneous Linux and FreeRTOS operation using Bao static partitioning, cache-coherent accelerator examples for both operating systems, and Ubuntu and Docker-based Linux configurations. A new bare-metal "Hello World" example provides a simple starting point for development. Updated Nios V design examples include Triple-Speed Ethernet (TSE) designs with FreeRTOS TCP/IP and web-server functionality for Agilex 3 and Agilex 5 devices. Additional enhancements include initial Agilex 27 Nios enablement and soft-processor debug module improvements. Additional Productivity, DSP Builder Machine Learning, and Device Support Enhancements Node Finder improvements include a persistent top-level hierarchy, single-click navigation, and side-by-side search results, making it easier to explore a design while maintaining context. DSP Builder expands machine-learning capabilities with new CNN layers, expanded activation-function support, and AI Tensor DSP optimizations. Enhanced network import, quantization, and automatic sizing simplify implementation, while new demos and MATLAB/Simulink MCP-based agentic workflows support model creation, updates, and verification. Device enablement also expands for Agilex 5 E-Series and D-Series, including additional temperature-grade support for Agilex 5 D-Series devices. AI models with FPGA AI Suite FPGA AI Suite 26.3 expands the tools and capabilities available for developing and integrating AI workloads. Beta features include spatial compiler and developer APIs that enable customers to build CNN and transformer models with examples (ResNet-8, Qwen 3.5, Majika, GPT-neo), and configurable external memory interface (EMIF) connectivity. Additional updates include a new Altera Model Zoo, better integration with the Altera Video and Vision Processing, SoC/x86 profiling, and VDS examples. New production-quality design examples for Agilex 3 Memory-to-Memory designs. These additions provide more options for model exploration, data-path integration, and performance analysis. Explore Quartus Prime (Pro Edition, 26.3) From project-aware AI assistance to enhancements in system design, power analysis, embedded development, and AI workloads, Quartus Prime Pro 26.3 provides new capabilities for your FPGA projects. Visit the Quartus Prime Pro website to learn more. What's New in the Quartus® Prime (Pro Edition) Design Software Download the Quartus® Prime (Pro Edition) version 26.3 Software Learn more about QuartusIQ Read the QuartusIQ white paper Learn more about FPGA AI Suite software Agilex 3 FPGAs and SoCs overview Agilex 5 FPGAs and SoCs overview Agilex 7 FPGAs and SoCs overview
8 days ago0likes
PACKET CLASSIFICATION | FPGA | NETWORKING + SECURITY Every packet decision starts with classification. Routers, firewalls, SmartNICs, security gateways, and service-edge platforms must determine which policy applies before traffic can be forwarded, blocked, inspected, redirected, or prioritized. TCAM earned its place in these systems because it provides predictable lookup behavior and native ternary matching for ACL and LPM workloads. But as policy databases grow, search keys widen, and rules change more frequently, the traditional approach of scaling specialized ternary memory creates tougher tradeoffs in capacity, power, resource utilization, and system integration. Altera Stellar solutions takes a different approach. Instead of scaling packet classification by building ever-larger ternary-memory structures, Stellar turns classification into an optimized search problem that runs on configurable FPGA resources. The result is an FPGA-native path for large, dynamic packet-classification tables without giving up the policy semantics that made TCAM useful in the first place. TCAM scales through memory expansion. Stellar scales through search intelligence. Keep the TCAM semantics. Change the scaling model. Stellar preserves the intent of ACL, LPM, and multi-field classification, but changes how those rules are represented and searched. The Stellar Software Stack organizes policies into optimized graph structures, partitions the rule database, and continuously manages those search structures as the database evolves. The hardware then executes the search using configurable FPGA search engines while rule information is stored in conventional memory resources. Depending on the configuration, Stellar can use on-chip M20K memory, eSRAM, DDR, or HBM. That gives architects more freedom to balance throughput, capacity, latency, power, and FPGA resource use around the needs of the actual system. Use dense memory where it makes sense, and intelligence where it matters A traditional TCAM combines storage and comparison circuitry inside specialized ternary-memory arrays. That architecture delivers deterministic matching, but scaling the table means scaling the specialized comparison structure as well. Stellar separates rule storage from search execution. Ternary information can be represented as value-and-mask data in conventional memory, while graph organization and software-managed optimization direct each search toward the relevant parts of the database. As tables grow from thousands of entries toward hundreds of thousands or millions, this creates a different path for scaling capacity and power. The white paper goes deeper into why this matters, including the tradeoffs between TCAM and Stellar, the role of memory hierarchy, and a set of Stellar configurations spanning different key widths, capacities, memory resources, and projected five-tuple performance. Bring classification into the programmable datapath The value is bigger than the lookup engine itself. Stellar is designed to operate inside the FPGA alongside packet parsing, telemetry, encryption, traffic management, host-interface logic, and customer packet-processing RTL. For system architects, that means classification can become part of the same programmable platform already handling the datapath. A firewall can pair large, dynamic ACL processing with the rest of its traffic pipeline. A router can combine LPM and policy enforcement with programmable networking functions. A SmartNIC can integrate flow classification with offload and customer-specific acceleration. That system-level flexibility is especially relevant for 100GE to 400GE designs where classification must scale without consuming the platform that surrounds it. Read the full whitepaper! The full Altera white paper, Altera TCAM Alternative Solutions Scale Packet Classification to Millions of Rules for Networking Equipment, explains the architecture behind Stellar and the design choices that make it different. It covers TCAM fundamentals and scaling limits, Stellar graph-based search and software partitioning, memory-hierarchy options, configuration examples, quantitative architectural comparisons, dynamic updates, and deployment use cases across networking and security. Read the white paper See how Stellar uses search intelligence, configurable FPGA resources, and a flexible memory hierarchy to create a scalable alternative for large ACL and LPM workloads.
1 month ago0likes
4 MIN READ
September 28, 2026 The next generation of embedded systems will not be defined by compute alone. It will depend on how quickly, reliably, and intelligently systems can move data from the physical world into AI engines and turn insights back into action. That message came through clearly at Embedded World North America 2026, held September 22–24 at the Anaheim Convention Center. For Altera, the show provided an opportunity to highlight a growing collaboration with NVIDIA and demonstrate the role of FPGAs in high-performance edge AI architectures. Connecting sensors to AI with flexibility and determinism At the center of the story was NVIDIA Holoscan Sensor Bridge technology. The solution creates a high-bandwidth, low-latency path between real-world sensors and GPU-based AI processing, an increasingly important capability for robotics, industrial automation, intelligent video, medical systems, and other physical AI applications. FPGAs are well suited to this role because they can provide deterministic processing, flexible I/O, and protocol adaptation close to the sensor. Rather than forcing every application into the same hardware configuration, FPGA-based designs can be tailored to performance, connectivity, and latency requirements of a specific system. In the show’s keynote, NVIDIA Vice President Deepu Talla described the value of this flexibility: “You can select any of the Altera FPGAs depending on the application and pair them with any of the NVIDIA frameworks.” Altera’s post noted that Altera offers Holoscan Sensor Bridge solutions spanning 10G to 100G, where 25G and 100G offer significantly more bandwidth compared to other Holoscan ecosystem partners, helping developers scale connectivity for demanding edge workloads. The result is a practical sensor-to-compute architecture: Altera FPGAs handle the flexible, deterministic front end, while NVIDIA platforms provide the accelerated environment for AI and robotics workloads. An ecosystem approach to accelerating development The demonstrations also underscored that successful edge AI deployments require more than individual components. Developers need reference designs, production-ready boards, and partners that help bridge the gap between evaluation and deployment. Altera’s growing Holoscan ecosystem includes more than 10 reference designs and partner boards. These building blocks can help teams reduce integration effort and move faster from proof of concept to a real-time AI product. One example was on display at Altera partner Critical Link’s booth. Critical Link was recognized as a Best in Show Award winner in the AI & Machine Learning category at the show. Visitors to the booth could see a live demonstration of a 5-camera Holoscan Sensor Bridge solution, using Critical Link’s MitySOM-A5E as the featured Agilex® 5 FPGA hardware platform. The demonstration showed how an Agilex 5 FPGA-based system can help bring sensor data into an NVIDIA-powered AI pipeline while preserving the low-latency, high-bandwidth behavior required by edge applications. From 10G to 100G: Building the data plane for edge AI Altera’s Holoscan Sensor Bridge solutions are designed to make the sensor-to-GPU path faster and more adaptable. A recent Altera technical blog describes 10G, 25G, and 100G reference designs, including a 25G design on Agilex 5 SoC FPGAs for multi-camera sensor data flow and accelerated processing at the edge. In this architecture, the FPGA serves as the data plane: connecting to diverse sensors, aggregating streams, adapting protocols, and preprocessing data before it reaches the NVIDIA GPU. That division of labor helps reduce data-movement bottlenecks while preserving deterministic timing and giving developers room to evolve the system as sensor interfaces and AI workloads change. Altera Technical Holoscan blog for Robotics: Altera Pushes the Boundaries of Edge AI with New Holoscan Sensor Bridge Solutions | Altera Community - 355665 Watch the 25G Holoscan demo video: YouTube/Altera Why the sensor-to-compute path matters As AI moves into physical environments, system designers are balancing several competing requirements: Real-time response: Applications such as robotics and industrial inspection cannot always afford the delay of sending raw sensor data to a remote system. High-bandwidth data movement: Modern sensors generate increasingly rich data streams that must be transported without creating a bottleneck. Deterministic behavior: Safety-critical and industrial systems need predictable timing and consistent performance. Design flexibility: Product teams must support different sensors, interfaces, and deployment conditions without redesigning the entire platform. Faster development: Reference designs and ecosystem partnerships can shorten the path from concept to production. The Altera and NVIDIA approach addresses these needs by combining FPGA-based connectivity and processing with GPU-accelerated AI. It gives developers a modular foundation for building systems that can adapt as sensors, models, and application requirements evolve. Building what comes next at the edge The conversation at Embedded World North America 2026 pointed toward a broader shift in embedded design. Edge systems are becoming intelligent, connected, and increasingly autonomous, but their performance still depends on the data path that feeds them. By pairing Altera FPGAs with NVIDIA platforms and collaborating with partners such as Critical Link, developers gain more options for designing that path. The combination of flexible hardware, high-speed connectivity, and accelerated AI can help transform raw sensor input into timely decisions at the point where data is created. For teams developing the next generation of robotics, industrial automation, intelligent vision, and physical AI systems, this is the opportunity: Build a sensor-to-compute architecture that is fast enough for today’s workloads, flexible enough for tomorrow’s requirements, and ready to scale from demonstration to deployment. Learn more about Altera’s Physical AI-related Solutions: Holoscan: https://www.altera.com/fpga-solutions/sensory-interfaces Robotics: https://www.altera.com/fpga-solutions/robotics-solutions-stack Video: https://www.altera.com/fpga-solutions/video-solutions-stack
1 month ago0likes
1 MIN READ
Altera has begun shipping the new Agilex® 7 M-Series R31G multi-host acceleration package, giving customers a new way to build high-bandwidth systems that connect more hosts while moving more data through the network and memory subsystem. R31G is designed for architectures where data must move quickly between the network, memory, and multiple CPUs, GPUs, or other hosts. By bringing 800G or 2x400G Ethernet together with expanded PCIe 5.0/CXL host connectivity, the package opens new possibilities for AI NICs, storage acceleration, cloud acceleration, and other high-throughput platforms. What R31G enables More network bandwidth: 800G or 2x400G Ethernet capability for high-throughput data paths. More host connectivity: Two PCIe 5.0 x16 host interfaces, or up to four independent PCIe 5.0 x8 connections, with CXL support for flexible multi-host architectures. More memory bandwidth and I/O: DDR5-6400 and LPDDR5-6400 support, up to 204.8 GBps of memory bandwidth, and 768 GPIO in a compact 56 x 45 mm package. The result is a programmable platform that can connect, accelerate, and adapt as infrastructure requirements evolve, while keeping high-speed networking, host connectivity, and memory bandwidth tightly integrated. More network bandwidth. More hosts. More memory bandwidth. One programmable platform. Learn more in the Agilex® 7 M-Series product site.
1 month ago0likes