Regarding the Footprint creation of AGFB022R24C2E2V

Hi 

For the  AGFB022R24C2E2V  

The package drawing specifies a solder resist opening of Ø0.50 ± 0.02 mm, but it does not specify the recommended PCB pad diameter. Could you please provide the recommended PCB land pattern, including the copper pad diameter and whether the pads should be solder mask defined (SMD) or non-solder mask defined (NSMD)?

Addition please provide the Allegro footprint for  AGFB022R24C2E2V