PAD ON VIA AND 0201 SIZES OF DECAP ON ARRIA 10 SOC DEVELOPMENT KIT
Hi,
We have designed several boards with CYCLONE V SOC and even though if the Kit recommended PAD ON VIAs for the FPGA we went ahead standard layout.
Here on ARRIA 10 SOC Kit, we see PAD ON VIA on FPGA with 0201 sizes of DECAP on BOTTOM Layer.
My query is that for ARRIA 10 SOC - whether a PAD ON VIA is needed or whether we can go with a Standard BGA Fanout and 0402 sizes of DECAPS as normal. This helps us in assembly, reduces PCB complexity, reduces costs, aids maintenance. Search for a reliable PCB manufacturer also becomes a task as we have never done this before.
However, we are aware of the fact that in very high speed designs PDN may improve due to PAD ON VIA and 0201 sizes but various people have various opinions in that regard.
Can you please let us know as to whether this is mandatory to have these two features or whether a standard layout can do. We are using SFP+, SGMII and JESD ADCs for our design.
A reply will be very very helpful here.