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GLefk's avatar
GLefk
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7 years ago

How do we send to Intel/Altera EN5339QI FPGA to Intel for failure analysis? There was a short on 1.8V on the power IC component. After replacing the power IC component, the drive was detected.

I am having difficulty navigating through Intel's website to find out how to get customer support.

8 Replies

  • Mostafa_Intel_AE's avatar
    Mostafa_Intel_AE
    Icon for Occasional Contributor rankOccasional Contributor
    6 years ago
    Hello Glenn, I have sent to you a personal Email, please help to provide the required information. Regards, Mostafa
  • GLefk's avatar
    GLefk
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    6 years ago

    Hi Mostafa,

    Thank you so much! I will fill out this Intel/Empirion Device Problem Report and return it to you for this one part. I really appreciate your support.

    Thanks,

    Glenn

  • GRuiy's avatar
    GRuiy
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    6 years ago

    Hi Mostafa,

    I am also looking to send a few Intel/Altera parts for failure analysis but cannot figure out where to go on the Intel website. Can you please help?

    Thanks,

    Gabriella

    • Mostafa_Intel_AE's avatar
      Mostafa_Intel_AE
      Icon for Occasional Contributor rankOccasional Contributor
      6 years ago

      Hi Gabriella,

      We are sorry for late response.

      To send any Intel/Enpirion devices for FA, you need to open a Forum case and mention that you need FA and please mention the device part number that has the failure, so you can get a faster response.

      Also you can contact Intel/Enpirion field engineer or the TS on your region, so he can help you to debug the device and also get the internal factory engineering support if needed.

      Also you can open an IPS (Intel Premier Support:https://www.intel.com/content/www/us/en/design/support/ips/training/welcome.html) case and request a FA for an Intel device.

      Regards,

      Mostafa

  • GLefk's avatar
    GLefk
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    6 years ago

    How do we get a status update for our failure analysis? We submitted one part a few weeks ago, but have heard nothing from Intel.

    We appreciate some feedback from Mostafa.

    Thanks,

    Glenn

    • Mostafa_Intel_AE's avatar
      Mostafa_Intel_AE
      Icon for Occasional Contributor rankOccasional Contributor
      6 years ago

      Hi Glenn,

      We are sorry if you had miss our email early on March 25th that have the FA report.

      I have re-attached that FA report to you today through the email, please help to confirm that you already successfully received it.

      Regards,

      Mostafa

  • GLefk's avatar
    GLefk
    Icon for New Contributor rankNew Contributor
    6 years ago

    Hi Mostafa,

    The Intel Failure Analysis report is excellent, very detailed. The report states that a few solder pads on the bottom of the device should not be soldered to the board.

    "Grey area highlights the exposed metal referred to as NC (No-Connect) or Keep Out Pads. These should not be electrically inter-connected or connected to the PCB. Solder on these pads suggest that these pins may have had exposure to electrical shorts with other pins. Failure to follow this guideline may result in part malfunction or damage."

    I would suggest that if you don't want these pads to be soldered, then don't put these solder pads on the component.

    Thanks,

    Glenn

  • Mostafa_Intel_AE's avatar
    Mostafa_Intel_AE
    Icon for Occasional Contributor rankOccasional Contributor
    6 years ago

    Hi Glenn,

    Thanks for your suggestion, but unfortunately these pads are necessary where it is related to the leadframe and it supports mounting the internal on package component.

    Regards,

    Mostafa