How do we send to Intel/Altera EN5339QI FPGA to Intel for failure analysis? There was a short on 1.8V on the power IC component. After replacing the power IC component, the drive was detected.

Hi Mostafa,

The Intel Failure Analysis report is excellent, very detailed. The report states that a few solder pads on the bottom of the device should not be soldered to the board.

"Grey area highlights the exposed metal referred to as NC (No-Connect) or Keep Out Pads. These should not be electrically inter-connected or connected to the PCB. Solder on these pads suggest that these pins may have had exposure to electrical shorts with other pins. Failure to follow this guideline may result in part malfunction or damage."

I would suggest that if you don't want these pads to be soldered, then don't put these solder pads on the component.

Thanks,

Glenn