Forum Discussion
To obtain the reflow profile for Intel® Agilex™ 7 FPGAs, it's recommended to adhere to the industry-standard guidelines provided by the IPC/JEDEC J-STD-020E specification. This standard outlines the moisture/reflow sensitivity classification for non-hermetic solid-state surface-mount devices and provides detailed reflow temperature profiles suitable for various components, including FPGAs.
Intel advises following the IPC/JEDEC J-STD-020E standard for reflow processes involving Agilex 7 FPGAs. This recommendation was highlighted in a response to a query about the reflow process for the Agilex AGFB012R24B2I3E FPGA model.
For comprehensive guidance on PCB design, including package and pinout information for Agilex 7 FPGAs, refer to the "Agilex 7 FPGAs and SoC FPGAs Package, Pinout, and PCB Design User Guide."
Please get from : https://cdrdv2-public.intel.com/814029/ug-814028-814029.pdf
By adhering to the IPC/JEDEC J-STD-020E standard and consulting Intel's design resources, you can ensure proper reflow processes for Agilex 7 FPGAs.