Forum Discussion
Warning part number CIE-080-1573-001_ Description_ IC_ FPGA_ CYCLONE IV E
"The UUT is failing on Verify SW step on Flash Test
Doing the measurements, we detected 1.5V_CPU be down
This signal is going directly to the FPGA located as U19
No defect related to solder, spheres and polarity on the BGA located as U19
Measurements of the bad signal with Curve Tracer Instrument shows that the BGA has an electrical defect"
5 Replies
- NurAiman_M_Intel
Super Contributor
Hi,
Thank you for contacting Intel community.
I have go through the attachment. However I might missed out some information.
-How many units are failing? eg: 3/10
-In the email, you mention the issue is Internal short.
-I will need to do further checking if the failure unit is too high
Regards,
Aiman
- PPere22
New Contributor
The failures of the last 10 weeks are 30/684.
See more details in the FA attached from test engineering team Flex, and let me know how proceed with the analisis of root cause.
Waiting for your comments.
- NurAiman_M_Intel
Super Contributor
Hi,
Please clarify below:
- The devices are fresh unit or you get the repack unit from distributor?
- Any test that you did that spike the current?
- Do you have any x-ray image for the bad unit?
Regards,
Aiman
- PPere22
New Contributor
Hi Aiman,
1.- The devices are Fresh, and come from Arrow Distribuitor. contact:
2.- We do not have current spike in the flash test that could directly affect the BGA
Being that the problem is detectable from ICT, the BGA was already damaged before reaching the "integration" part.3.- Yes, attahing photos, you can see details in the phto 2&3.
Please let me know the next steps for to give with the root cause.
Waiting for your response.
Pablo.
- NurAiman_M_Intel
Super Contributor
Hi Pablo,
I have response to you through forum email. I will proceed to close this case for now.
Regards,
AIman