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Ed6's avatar
Ed6
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6 years ago
Solved

Lid Removal

What is the temperature needed to soften the adhesive between the lid and die of the programmable gate array FPGA 10AX066N2F40I1HG?

General
  • Ed6's avatar
    Ed6
    6 years ago

    Yes; we spoke with the SME last night and obtained our answer plus a way to answer future questions through the Premier Service. Thank you very much for your help!

11 Replies

  • NurAiman_M_Intel's avatar
    NurAiman_M_Intel
    Icon for Super Contributor rankSuper Contributor
    6 years ago

    Hi,


    Thank you for your update. I will close this case. In the future, kindly use IPS for further support.


    Regards,

    Aiman


  • NurAiman_M_Intel's avatar
    NurAiman_M_Intel
    Icon for Super Contributor rankSuper Contributor
    6 years ago

    Hi,


    Do you have any update? Have you contacted the person in the email that I have sent you?


    Thank you.


    Regards,

    Aiman


    • Ed6's avatar
      Ed6
      Icon for New Contributor rankNew Contributor
      6 years ago

      Yes; we spoke with the SME last night and obtained our answer plus a way to answer future questions through the Premier Service. Thank you very much for your help!

  • NurAiman_M_Intel's avatar
    NurAiman_M_Intel
    Icon for Super Contributor rankSuper Contributor
    6 years ago

    Hi Ed6,


    I have emailed you the contact person for further action. Please take a look and let me know once you contacted the person.


    Thanks.


    Regards,

    Aiman


    • BD28's avatar
      BD28
      Icon for New Contributor rankNew Contributor
      5 years ago

      Hi Aiman,

      who is the contact engineer that has the solution for this issue?

    • Ed6's avatar
      Ed6
      Icon for New Contributor rankNew Contributor
      6 years ago

      Unfortunately, that did not tell me how to remove the lid from the IC without damaging the die and other internal components. Can you please provide the process we can follow to remove the metal lid from the Integrated Circuit without damaging the die and other internal components. It appears the metal lid is held on to the die by an epoxy.

    • Ed6's avatar
      Ed6
      Icon for New Contributor rankNew Contributor
      6 years ago
      1. Hi -
      2. No; we are performing a Destructive Physical Analysis (DPA) on these parts as required by the US Department Of Defense. We are not trying to solder this IC to a board. We are trying to remove the lid to be able to perform Scanning Acoustic Microscopy on the part. How would you recommend that we remove the lid from the part without damaging the internal parts?
  • AndrewG_Intel's avatar
    AndrewG_Intel
    Icon for Occasional Contributor rankOccasional Contributor
    6 years ago

    Hello Ed6

    Thank you for posting on the Intel® communities.


    After checking your inquiry, we noticed it is regarding Intel® Arria 10 GX FPGA - Field Programmable Gate Array (part number 10AX066N2F40I1HG). We have a forum for these specific products and inquiries so we are moving this to the Programmable Devices forum so it can get answered more quickly.

    https://community.intel.com/t5/Programmable-Devices/bd-p/programmable-devices


    Best regards,

    Andrew G.

    Intel Customer Support Technician