Forum Discussion
Ed6
New Contributor
New ContributorLid Removal
What is the temperature needed to soften the adhesive between the lid and die of the programmable gate array FPGA 10AX066N2F40I1HG?
Yes; we spoke with the SME last night and obtained our answer plus a way to answer future questions through the Premier Service. Thank you very much for your help!
NurAiman_M_Intel
Super Contributor
Super ContributorHi,
Thanks for your response.
Per my understanding, you are referring to the reliability report,:
https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/rr/rr.pdf
Regards,
Aiman
Ed6Unfortunately, that did not tell me how to remove the lid from the IC without damaging the die and other internal components. Can you please provide the process we can follow to remove the metal lid from the Integrated Circuit without damaging the die and other internal components. It appears the metal lid is held on to the die by an epoxy.
