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Ed6's avatar
Ed6
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6 years ago
Solved

Lid Removal

What is the temperature needed to soften the adhesive between the lid and die of the programmable gate array FPGA 10AX066N2F40I1HG?
  • Ed6's avatar
    Ed6
    6 years ago

    Yes; we spoke with the SME last night and obtained our answer plus a way to answer future questions through the Premier Service. Thank you very much for your help!