Forum Discussion
Ed6
New Contributor
New ContributorLid Removal
What is the temperature needed to soften the adhesive between the lid and die of the programmable gate array FPGA 10AX066N2F40I1HG?
Yes; we spoke with the SME last night and obtained our answer plus a way to answer future questions through the Premier Service. Thank you very much for your help!
NurAiman_M_Intel
Super Contributor
Super ContributorHi,
Thank you for contacting Intel community.
Are you referring to process reflow? If yes, kindly go to the link below for further information:
https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/an/an353.pdf
Thank you.
Regards,
Aiman
Ed6- Hi -
- No; we are performing a Destructive Physical Analysis (DPA) on these parts as required by the US Department Of Defense. We are not trying to solder this IC to a board. We are trying to remove the lid to be able to perform Scanning Acoustic Microscopy on the part. How would you recommend that we remove the lid from the part without damaging the internal parts?
