Forum Discussion
Ed6
New Contributor
5 years agoLid Removal
What is the temperature needed to soften the adhesive between the lid and die of the programmable gate array FPGA 10AX066N2F40I1HG?
- 5 years ago
Yes; we spoke with the SME last night and obtained our answer plus a way to answer future questions through the Premier Service. Thank you very much for your help!
NurAiman_M_Intel
Super Contributor
5 years agoHi,
Do you have any update? Have you contacted the person in the email that I have sent you?
Thank you.
Regards,
Aiman
Ed6
New Contributor
5 years agoYes; we spoke with the SME last night and obtained our answer plus a way to answer future questions through the Premier Service. Thank you very much for your help!