Forum Discussion

Ed6's avatar
Ed6
Icon for New Contributor rankNew Contributor
5 years ago
Solved

Lid Removal

What is the temperature needed to soften the adhesive between the lid and die of the programmable gate array FPGA 10AX066N2F40I1HG?
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  • Ed6's avatar
    Ed6
    5 years ago

    Yes; we spoke with the SME last night and obtained our answer plus a way to answer future questions through the Premier Service. Thank you very much for your help!

NurAiman_M_Intel's avatar
NurAiman_M_Intel
Icon for Super Contributor rankSuper Contributor
5 years ago

Hi Ed6,


I have emailed you the contact person for further action. Please take a look and let me know once you contacted the person.


Thanks.


Regards,

Aiman


  • BD28's avatar
    BD28
    Icon for New Contributor rankNew Contributor
    5 years ago

    Hi Aiman,

    who is the contact engineer that has the solution for this issue?