Event no 119751

Hello,

I'm Ionela Hagighiol ,SQE from Flex, Romania and we have the below issue with this part manufactured by you.

Please advise how to proceed further.

Component details:

Material PN	ALC3-1AB310260004_REP
Material Description	ICFPGA5SGXMA7N2F45I3NStratix5B
Material SN or Lot Nr	N/A
Date Code or Part Mark	1607
Supplier Name	ARROW ASIA DISTRIBUTION GBR
Supplier PN/MPN	5SGXMA7N2F45I3N

1. Problem description: Rx SM BIP8 Error Count on L1CH2 during prechamber ramp-up from -5°C to 50°C

2. Detected by: Customer field failure, failure confirmed by factory tests

3. Quantity Affected: 1 PCS

4. Failure Message: SM BIP8 Error Count on L1CH2 on PM

5. Flex or Nokia analysis:

This unit failed in field at customer. At Flex factory tests it failed with Rx SM BIP8 Error Count on L1CH2 during prechamber ramp-up from -5°C to 50°C. The suspected component for the issue was Obelix component (ALC3-1AB310260004_REP) and was sent to be replaced. With the new component the unit passed tests. Obelix component to be sent to supplier to re-run tests and find root cause of failure.

Replacing the component solved the problem and card passed factory tests.