Forum Discussion
ak6dn
Regular Contributor
3 years agoThe die will be the same for different packages. 10CL016.
Not even Intel is big enough (or foolish enough) to have different dies per package.
In smaller packages not all the I/Os get bonded out. They are just unused.
Search for 10CL016 here to get package pinlist files:
https://www.intel.com/content/www/us/en/support/programmable/support-resources/devices/lit-dp.html