Forum Discussion
AminT_Intel
Regular Contributor
4 years agoHello,
OPN: 10M16DCU324I7G
Package Type: U
Package Code: 324
From Altera Device Package Information they are 324-Pin Ultra FineLine Ball-Grid Array (UBGA) - Wire Bond. Thus, they are 0.70mm UBGA (wirebond) from Table 3.
Thanks
AminT_Intel
Regular Contributor
4 years agoHello,
Sorry there was a typo. It was 0.80 mm not 0.70 mm