Forum Discussion

SLB-Aman_Arab's avatar
SLB-Aman_Arab
Icon for New Contributor rankNew Contributor
10 months ago
Solved

Need PCB land pattern for part EP4CE6F17C8N

Hello Team,

Please share the recommended land pattern for part EP4CE6F17C8N.

Thanks,

Aman Arab

Fpga Devkit

4 Replies

  • Farabi's avatar
    Farabi
    Icon for Regular Contributor rankRegular Contributor
    10 months ago

    Hi Aman,

    Please refer to attached package drawing for land pattern recommendation. link : https://www.intel.com/content/dam/altera-www/global/en_US/pdfs/literature/packaging/04R00230-03.pdf

    FBGA-256 Ball Grid Array- 0.8mm pitch

    Ball pitch = 0.8mm

    Pad(Land) Diameter = 0.3mm to 0.35mm

    Solder Mask Opening = 0.4mm

    Pad Type = NSMD (Non-Solder Mask Defined) recommended

    NSMD Pad size = 0.30mm to 0.33mm diameter

    Solder Mask Clearance = +0.05mm all around pad

    Package size = 17mm x 17mm

    regards,
    Farabi

    • SLB-Aman_Arab's avatar
      SLB-Aman_Arab
      Icon for New Contributor rankNew Contributor
      10 months ago

      Hello Farabi,

      Thank you for your response. We kindly request the pin numbering details from pin 1 to pin 256, along with the corresponding pin functions/significance for each. This information is essential for our analysis and proper integration. The details you shared are helpful in understanding the footprint only.

      Thanks,

      Aman Arab

      • SLB-Aman_Arab's avatar
        SLB-Aman_Arab
        Icon for New Contributor rankNew Contributor
        10 months ago

        Hello Team,

        Any updates on the requested PINs details?

        Thanks,

        Aman Arab