Forum Discussion

SLB-Aman_Arab's avatar
SLB-Aman_Arab
Icon for New Contributor rankNew Contributor
1 year ago
Solved

Need PCB land pattern for part EP4CE6F17C8N

Hello Team,

Please share the recommended land pattern for part EP4CE6F17C8N.

Thanks,

Aman Arab

Fpga Devkit

4 Replies

  • Farabi_Altera's avatar
    Farabi_Altera
    Icon for Regular Contributor rankRegular Contributor
    1 year ago

    Hi Aman,

    Please refer to attached package drawing for land pattern recommendation. link : https://www.intel.com/content/dam/altera-www/global/en_US/pdfs/literature/packaging/04R00230-03.pdf

    FBGA-256 Ball Grid Array- 0.8mm pitch

    Ball pitch = 0.8mm

    Pad(Land) Diameter = 0.3mm to 0.35mm

    Solder Mask Opening = 0.4mm

    Pad Type = NSMD (Non-Solder Mask Defined) recommended

    NSMD Pad size = 0.30mm to 0.33mm diameter

    Solder Mask Clearance = +0.05mm all around pad

    Package size = 17mm x 17mm

    regards,
    Farabi

    • SLB-Aman_Arab's avatar
      SLB-Aman_Arab
      Icon for New Contributor rankNew Contributor
      1 year ago

      Hello Farabi,

      Thank you for your response. We kindly request the pin numbering details from pin 1 to pin 256, along with the corresponding pin functions/significance for each. This information is essential for our analysis and proper integration. The details you shared are helpful in understanding the footprint only.

      Thanks,

      Aman Arab

      • SLB-Aman_Arab's avatar
        SLB-Aman_Arab
        Icon for New Contributor rankNew Contributor
        1 year ago

        Hello Team,

        Any updates on the requested PINs details?

        Thanks,

        Aman Arab