Hi,
Please refer below for the information requested.
1. What is the failure rate? What is the failure rate vs. tested sample? Example: 2 out of 100 units.
13 out of 1000+
2. When did the failure happen? How did you discover the failure?
All are line rejects on board level.
3. How did you determine the failure? Please elaborate the procedures.
- Measure impedance on board and found short from 3.3V to DCOM.
- Remove component on the trace from 3.3V to DCOM one by one to narrow down the issue.
- After removed inductor FL19, no short from 3.3V to FL19. (FL19 is connected to 3.3V and FPGA C7, D7, D8, E8),
- Then, both 5DX and 2DX performed on FPGA and no visible short found.
- Measure impedance from C7, D7, D8, E8 to C8 and D6. (FPGA C8 and D6 are connected to DCOM)
- Remove FPGA from board and measure impedance on board and FPGA, no short was found on board. Short was happened on FPGA.
4. Does the failure unit ever working before failure?
We did not perform screening for raw FPGA
5. Did they violate solder re-flow temperature profiles, moisture sensitivity? Please provide the re-flow temperature profiles.
TBA
6. Did you swap the failure device to a known good board? Is the failure following the device or board?
Swapping performed on 2 boards, both are working after swap with good FPGA. The failure follows the device.
7. Is this a prototype build or volume/mass production?
Mass production
I will upload the re-flow temperature profiles and board schematic once I have it.
Thanks.