Intel MAX 10 FPGA short issue

Hi ,

To understand more about the issue, can you please share with me some information?

1. What is the failure rate? What is the failure rate vs. tested sample? Example: 2 out of 100 units.
2. When did the failure happen? How did you discover the failure?
3. How did you determine the failure? Please elaborate the procedures.
4. Does the failure unit ever working before failure?
5. Did they violate solder re-flow temperature profiles, moisture sensitivity? Please provide the re-flow temperature profiles.
6. Did you swap the failure device to a known good board? Is the failure following the device or board?
7. Is this a prototype build or volume/mass production?

Thanks!

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