Occasional Contributorwe have FPGA device (Stratix 10) failed flying probe test Q'ty 1 pcs from product NPI. After verify, we found the resistance of pin BC41 (VCCT_GXBL1C) vs pin BB43 (Gnd) is low resistance(23 Ohm) compare good device (286 Ohm). we need to return FPGA device back to Intel for analysis. please help to review.
Regular Contributor
Occasional ContributorDear Dlim,
Yes, same failure unit. we agree to close other forum (FPGA DEVELOPERS\PROGRAMMABLE DEVICES).
for Cisco CE : "Alex Pan (yangpan)" <yangpan@cisco.com>
Occasional ContributorDear Dlim,
Can you pls review and advise FA number and shipping information ASAP? if you need more information, pls let us know
Frequent ContributorDear Rungurang Sangpratheep,
Understand this is duplicate request for case#04235800.
I will send you a private message for shipping guidelines and instructions.
While waiting for shipment process, could you please provide us :
1. What is the failure symptom? Please elaborate the failure symptom in detail.
2. When did the failure happen? How did you discover the failure?
3. How did you determine the failure? Please elaborate the procedures.
4. Does the failure unit ever working before failure?
5. Did they violate solder re-flow temperature profiles, moisture sensitivity? Please provide the re-flow temperature profiles.
6. Did you swap the failure device to a known good board? Is the failure following the device or board?
-Wani-
Occasional ContributorDear Wani,
Please find the answers inline
1. What is the failure symptom? Please elaborate the failure symptom in detail.
[CTH]: Flying probe failed pin "VP1P12_VCCT_GXB" impedance abnormal. Pls see detail in FA report
2.When did the failure happen? How did you discover the failure?
[CTH]: during Flying probe test.
3.How did you determine the failure? Please elaborate the procedures.
[CTH]: Pls see detail in FA report.
4.Does the failure unit ever working before failure?
[CTH]: Never worked before.
5.Did they violate solder re-flow temperature profiles, moisture sensitivity? Please provide the re-flow temperature profiles.
[CTH]: Peak temperature of reflow soldering on this BGA is 236 degree C follow per supplier recommend (not over 245 degree C).
6.Did you swap the failure device to a known good board? Is the failure following the device or board?
[CTH]:we cannot swaps the component with know good board due to customer not allow to use re-ball component. Referring verification result FA report confirm relate with BGA device.
Frequent ContributorOccasional ContributorDear Wani,
the tracking number ref# 104360958664 for F#04238834
Frequent ContributorThank you! I will let you know once i received the package.
Wani
Occasional ContributorDear Wani,
Would you please share with us the progress of this case?
Occasional ContributorDear Wani,
Please help to update test result by e-mail first. we need to use the data for update Cisco team
Occasional ContributorDear Wani,
Can you update prelim result for this case? Cisco team need to know the progress of this case
