Forum Discussion
Dear Wani,
Please find the answers inline
1. What is the failure symptom? Please elaborate the failure symptom in detail.
[CTH]: Flying probe failed pin "VP1P12_VCCT_GXB" impedance abnormal. Pls see detail in FA report
2.When did the failure happen? How did you discover the failure?
[CTH]: during Flying probe test.
3.How did you determine the failure? Please elaborate the procedures.
[CTH]: Pls see detail in FA report.
4.Does the failure unit ever working before failure?
[CTH]: Never worked before.
5.Did they violate solder re-flow temperature profiles, moisture sensitivity? Please provide the re-flow temperature profiles.
[CTH]: Peak temperature of reflow soldering on this BGA is 236 degree C follow per supplier recommend (not over 245 degree C).
6.Did you swap the failure device to a known good board? Is the failure following the device or board?
[CTH]:we cannot swaps the component with know good board due to customer not allow to use re-ball component. Referring verification result FA report confirm relate with BGA device.