EP4CE55f23I7N

Hi,

Thank you for reaching out. Allow me some time to look into your issue. I shall come back to you with findings.

Thank you for your patience.

Best Regards,

Nazrul Naim

Hello,

Sorry for the delay. I'm still in the midst of the discussion regarding this with the internal teams. Unfortunately, it takes longer than usual heard. I will plan on letting you know as soon as I learn more information. Really appreciate your patience.

Warm Regards,

Nazrul Naim

Hello,

Sorry for the delay. Which POD document were you referring to? The POD is in the link below. There is no Option-3.

The difference between Option-1 and Option-2 is the dimples created by mold ejector pins on Option-2.

Link : https://www.intel.com/content/dam/altera-www/global/en_US/pdfs/literature/packaging/04R00416-03.pdf

Best regards,

Nazrul Naim

Hello,

​

Based on the information from our internal teams and also according to the official documentation which have been provided in the previous comment. There are only 2 options. There is no Option-3 mentioned in the official documentation for this device.

​

I'm truly sorry for the inconvenience and please let me know if I can be of any further assistance.

Below I will also attach the link for the official website for this device documentation.

Link : Packaging (intel.com)

Best regards,

Nazrul Naim

Hi,

As we do not receive any response from you on the previous question/reply/answer that we have provided, for now I will set this case to Close-Pending.

Regards,

Nazrul Naim