JeDiFoX
New Contributor
New ContributorEP4CE55f23I7N
Why do EP4CE55f23I7N chips made in Korea come in different packages? What is the difference between 484-FBGA-wire bond-a:2.40 and 484-FBGA,Options 3-wire bond?
Forum Discussion
NazrulNaim_Intel
Regular Contributor
Regular ContributorHello,
Sorry for the delay. Which POD document were you referring to? The POD is in the link below. There is no Option-3.
The difference between Option-1 and Option-2 is the dimples created by mold ejector pins on Option-2.
Link : https://www.intel.com/content/dam/altera-www/global/en_US/pdfs/literature/packaging/04R00416-03.pdf
Best regards,
Nazrul Naim
JeDiFoXNew Contributor
New ContributorThe photo shows a microcircuit in a 484-FBGA package, 3-wire connection options. Either this is a fake, or there is such a case, can you answer this question for me?
