JeDiFoX
New Contributor
2 years agoEP4CE55f23I7N
Why do EP4CE55f23I7N chips made in Korea come in different packages? What is the difference between 484-FBGA-wire bond-a:2.40 and 484-FBGA,Options 3-wire bond?
Hello,
Sorry for the delay. Which POD document were you referring to? The POD is in the link below. There is no Option-3.
The difference between Option-1 and Option-2 is the dimples created by mold ejector pins on Option-2.
Link : https://www.intel.com/content/dam/altera-www/global/en_US/pdfs/literature/packaging/04R00416-03.pdf
Best regards,
Nazrul Naim