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speranskyanton's avatar
speranskyanton
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6 months ago

5M2210ZF256I5N

Hello!
I really need your help with part number 5M2210ZF256I5N.

What solder ball alloy composition is acceptable if the original documentation specifies Sn 96.5%, Ag 3%, Cu 0.5%?

How can we determine which types of scratches under the solder balls are acceptable, and what should we pay attention to during visual inspection of the component?

How are the components cleaned after solder mask application, and what kind of cleaning marks (e.g., minor scratches) may remain?

All photos are attached below.

Thank you very much for your assistance!

Fpga Devkit

15 Replies

    • speranskyanton's avatar
      speranskyanton
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      5 months ago

      Hello!
      This question concerns the composition of the solder balls. The documentation specifies 96.5% Sn, 3% Ag, and 0.5% Cu.
      Could you please clarify what deviations in composition are acceptable?

      Also, please take a look at the attached photos — there are scratches under the BGA balls and signs of cleaning or abrasion.
      Is this considered normal?
      Can the surface become scratched like this during the manufacturing process?

      Thank you!

  • NurAiman_M_Intel's avatar
    NurAiman_M_Intel
    Icon for Super Contributor rankSuper Contributor
    5 months ago

    Hi,


    I am not quite understand.


    Do you mean you received the device and it already has the scratches?

    Or it happens after you wash the device?


    From who did you make the purchase? Kindly let us know.


    FYI,

    Scratch criteria is 2mm max.

    If this is a 0.6 or 0.5mm mm solder ball, then the scratch does not exceed that it should not be a concern.

    Another way to gauge is if the scratch extends beyond 3 solder balls, then that is likely outside the criteria.

    Also, if the you does not see any of the underlying layers, then low risk to reliability, functionality or performance.


    Regards,

    Aiman


    • speranskyanton's avatar
      speranskyanton
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      5 months ago

      Hello!
      Thank you very much for your reply!

      I will attach several numbered photos showing different defects on the solder mask of these components. Please have a look — I believe the defects are not critical and could have occurred during manufacturing.

      1. Slight deformation of the solder balls, presumably due to long-term storage — I believe it should not affect soldering.

      2. Inclusions under the mask — it seems the surface may not have been properly cleaned from dust before the mask was applied.

      3. A strange inclusion on the mask, as if a second layer — it's not near the solder balls. What could this be?
      4.1, 4.2, and 4.3: Abrasions on the mask — could such marks remain from cleaning during production, and are they acceptable?
      5.1, 5.2, and 5.3: Scratches of varying lengths passing under several solder balls. They are shallow, and the mask is not scratched through — are such minor scratches acceptable?

      I would really appreciate your help in evaluating these!

      Thank you!

  • NurAiman_M_Intel's avatar
    NurAiman_M_Intel
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    4 months ago

    Hi,


    I have forwarded the photo and questions to our quality team for review.


    Will update you once I have the answer.


    Regards,

    Aiman


  • NurAiman_M_Intel's avatar
    NurAiman_M_Intel
    Icon for Super Contributor rankSuper Contributor
    4 months ago

    Hi,


    Update from our quality team,


    Below are the existing criteria.

    While some of these units may fail the criteria, specifically the scratches, we have not had any history of validated failures associated with surface scratches such as what is seen on these images.

    Substrate scratches:

    • Reject scratch greater than 80 mils (~2mm) in any direction.

    Solder ball criteria:

    • Visible damage at 1x magnification (naked eye or unaided human vision inspection) that leads to out of spec ball height.
    • Reject if any foreign material is found on solder balls with length greater than half the ball diameter.
    • Reject for any visible misalignment (against the pad) at 1x magnification (naked eye or unaided human vision inspection).

    Regards,

    Aiman


    • speranskyanton's avatar
      speranskyanton
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      4 months ago

      Hello,
      Thank you very much for the quick and thorough response.
      Just to confirm — would you say that the photos with the defects I sent you look acceptable in the end?
      Thank you!

  • NurAiman_M_Intel's avatar
    NurAiman_M_Intel
    Icon for Super Contributor rankSuper Contributor
    4 months ago

    Hi,


    As mention, we have not had any history of validated failures associated with surface scratches such as what is seen on these images.


    However, if your device does not meet the criteria that was listed in my previous response, then they are good to go.


    Regards,

    Aiman


    • speranskyanton's avatar
      speranskyanton
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      4 months ago

      Some of the scratches actually go across multiple balls, but they don’t look like reballing marks.
      Also, could you please send the full list of acceptable criteria for BGA packages in general?
      Thank you!

    • speranskyanton's avatar
      speranskyanton
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      4 months ago

      Hello!
      I really need your final conclusion regarding all the defects described above and the attached photos.
      Do you consider these components to be of acceptable quality or not?
      Please respond clearly with only your opinion.
      Thank you!

    • speranskyanton's avatar
      speranskyanton
      Icon for Occasional Contributor rankOccasional Contributor
      3 months ago

      Hello!
      Please provide your final answer — do you consider the ICs in the photos acceptable or not?
      Thank you!

  • speranskyanton's avatar
    speranskyanton
    Icon for Occasional Contributor rankOccasional Contributor
    3 months ago

    Hello!
    Could you please provide your final answer regarding the quality of the ICs?
    Thank you!