Forum Discussion
speranskyanton
Occasional Contributor
Occasional Contributor5M2210ZF256I5N
Hello! I really need your help with part number 5M2210ZF256I5N. What solder ball alloy composition is acceptable if the original documentation specifies Sn 96.5%, Ag 3%, Cu 0.5%? How can we determ...
NurAiman_M_Intel
Super Contributor
Super ContributorHi,
Do you mean reflow process? You may refer below:
Regards,
Aiman
speranskyantonHello!
This question concerns the composition of the solder balls. The documentation specifies 96.5% Sn, 3% Ag, and 0.5% Cu.
Could you please clarify what deviations in composition are acceptable?Also, please take a look at the attached photos — there are scratches under the BGA balls and signs of cleaning or abrasion.
Is this considered normal?
Can the surface become scratched like this during the manufacturing process?Thank you!
- speranskyanton
Hello!
May I receive a response?
Thank you!
.png){kind=link}
.png){kind=link}
.png){kind=link}