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speranskyanton's avatar
speranskyanton
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6 months ago

5M2210ZF256I5N

Hello! I really need your help with part number 5M2210ZF256I5N. What solder ball alloy composition is acceptable if the original documentation specifies Sn 96.5%, Ag 3%, Cu 0.5%? How can we determ...
Fpga Devkit
speranskyanton's avatar
speranskyanton
Icon for Occasional Contributor rankOccasional Contributor
5 months ago

Hello!
This question concerns the composition of the solder balls. The documentation specifies 96.5% Sn, 3% Ag, and 0.5% Cu.
Could you please clarify what deviations in composition are acceptable?

Also, please take a look at the attached photos — there are scratches under the BGA balls and signs of cleaning or abrasion.
Is this considered normal?
Can the surface become scratched like this during the manufacturing process?

Thank you!