To INTEL - Request for Compliance Data from your customer
Dear Sir/Madam, GreenSoft Technology, a leading provider of environmental compliance data management services and software for the global electronics industry (http://www.greensofttech.com), has been contracted by your customer to collect compliance data on parts purchased from your company or request the latest update on the data you previously submitted due to recent regulatory changes. Please note that your custom might not purchase directly from your company but via a reseller or distributor. In addition, you may need to collect material or compliance documents from your suppliers to fulfill this request. Your support to your customer is highly appreciated. Please refer the below part number: P/N: 10M50DAF484I7G Description: FPGA - Field Programmable Gate Array non-volatile FPGA, 360 P/N: 5M2210ZF256C4N Description: IC CPLD 1700MC 7NS 256FBGA P/N: 10AS057N2F40I2LG Description: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip If you think we reach out to you by mistake, please let us know right away so we will stop contacting you. Data requirements EU RoHS Directive 2011/65/EU as amended by (EU) 2015/863 • REACH SVHC per Article 33 of EU Regulation 1907/2006 • Part Weight and Unit of Measurement. • Full Material Disclosure (FMD), MSDS, steel/metal grade, or similar documents in your standard format if available. • Lifecycle Status (part is Active in selling or has become Obsolete or in the EOL process) If there is any data you can’t provide at this time, please just fill “Unknown”. If you have any questions, please visit our suppliers' page at https://www.greensofttech.com/suppliers/. You may contact us by phone at +1 323-254-5961 x 2, and our Support Engineers will help you with your questions. If no one is available, please leave a voice mail with your name, company's name, questions about the request, and the best number to reach you. If you need to contact me directly, please email me at the email address listed below.
5AGXFB7K4F40C5G
Altera, After working with Intel. They couldn't respond if these were reproduce with "Metal Top" by Customer's demand. Altera's doc only show top as "Thermal Composite". Also, please provide a datasheet. Has this part# been reproduce? Date Code 2339/Lot Code S337MK52. Hi BXion2, Thanks for your question. This thread has already been closed, so it may not get the attention needed for a proper response. Would you mind opening a new thread for this? That will help the community and Altera team track and respond more effectively. You can reference this thread in your new post for context. In your new thread, it may help to include: Date codes and lot markings of the devices you observed Source of purchase, if known Photos of the package lids if available The package drawing link you are comparing against This will make it easier for others to provide accurate guidance. Appreciate your understanding. Regards, Fakhrul
BGA TDN-741-954-61 (MPN# 5SGXMABK3H40C2LG ) short bridging issue for BGA
Hi Intel Team, We found the solder bridging issue observed on BGA component (Part No: TDN-741-954-61_MPN#5SGXMABK3H40C2LG ) used in the Teradyne TDN-627-000-40 model. Background: We have been experiencing intermittent (on-and-off) solder bridging defects, predominantly located at the edge of the BGA during SMT assembly. Although the occurrence rate is relatively low (16/1200 boards), the repetition across builds has raised concern on potential component-related contribution. To further understand the failure mechanism, a Shadow Moiré (TherMoire) analysis was conducted to evaluate the package coplanarity behavior across the full reflow temperature profile. Summary of Key Findings: De-soldered (failed) sample shows higher warpage, with coplanarity up to 9.8 mil Incoming reference sample shows lower warpage, with max ~6.4 mil Warpage remains ~5 mil even near peak reflow temperature (220–250°C) Observed defect location (BGA edge bridging) is consistent with warpage-induced coplanarity. These findings suggest that package warpage at elevated temperature could be a contributing factor to the observed solder bridging. Please do advise and provide the details following questionnaire: - Confirm warpage/coplanarity specification limits at reflow condition and whether our observed (~9.8 mil) is within acceptable range. Provide details on BGA material properties, especially Tg and its impact on warpage behavior during reflow. Explain the difference between good (incoming) vs failed sample in terms of warpage. Share warpage control method and monitoring at supplier side (e.g., measurement method, control limits). Provide lot traceability check to identify any variation or abnormality if have. Advise on risk of solder bridging due to warpage and recommended mitigation as the stencil opening followed recommendation. Flex Penang would like to send for FA. Please kindly provide RMA, forwarder account, shipping details, attention to and contact number. Thanks, Norizwan
