New Contributor基板実装後の清掃可否
エレックデータ株式会社と申します。そして私は飯久保です。
基板実装後の洗浄可否について、自社品数を対象に調査を行っています。
洗浄条件を整理しました。
御社の製品のカタログ等に洗浄条件を記載した資料が見当たりませんでしたが、フロー/リフローはんだ実装後の洗浄条件を明記した資料はありますか?
もしそうなら、私は資料を受け取りたいです。
洗浄条件が不可能な場合でも、それを明記した文書があると便利です。
品番
| 5M240ZT100C4N |
| 5M240ZT100C5N |
| 10CL016YF484C8G |
| EPCQ32ASI8N |
| 10CL010ユウ256C6G |
| 10CL010ユウ256C8G |
| 10CL025ユウ256C8G |
| 10CL040YF484C8G |
| 10CL055YF484C8G |
| 10M08SCE144C8G |
Regular ContributorHello,
Sorry for the delay. I'm still in the midst of the discussion regarding this with the internal teams. Unfortunately, it takes longer than usual heard. I will plan on letting you know as soon as I learn more information. Really appreciate your patience.
Warm Regards,
Nazrul Naim
Regular ContributorHello,
Sorry for the delay. Most of the devices/packages are either:
Both these type of packages can be washed. However, for the flip chip, we need to temporary seal the side vents. There is a process for this in the S10 MAS.
Take note that both these types of packages can be washed after SMT onto the boards. However, the boards/components need to be bake dry (above 100C) to remove all liquids. This will prevent delamination of the board and devices.
Hope that answers your question.
Best regards,
Nazrul Naim
Best reagrds,
Nazrul Naim
Regular ContributorHi,
As we do not receive any response from you on the previous question/reply/answer that we have provided, for now I will set this case to Close-Pending.
Regards,
Nazrul Naim
