Forum Discussion
NazrulNaim_Intel
Regular Contributor
2 years agoHello,
Sorry for the delay. Most of the devices/packages are either:
- Wire Bonded Plastic Packages or
- Flip Chip Packages with vents underneath the lid
Both these type of packages can be washed. However, for the flip chip, we need to temporary seal the side vents. There is a process for this in the S10 MAS.
Take note that both these types of packages can be washed after SMT onto the boards. However, the boards/components need to be bake dry (above 100C) to remove all liquids. This will prevent delamination of the board and devices.
Hope that answers your question.
Best regards,
Nazrul Naim
Best reagrds,
Nazrul Naim