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So how did you route this package without the microvias?
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I've (finally) managed to have a look over the job I mentioned. It was a Cyclone III device in a MBGA-164 package. It looks like I used a 0.2mm pad for the via with a 0.1mm drill. This, along with a 0.2mm PCB pad for the device ball, allowed me to place vias in the centre of 4 pads, as you would normally for a larger pitch BGA package. All this allowed for full vias through a 0.8mm thick 6 layer board.
What PCB technology bracket this falls into will vary (a little) between vendors. My memory of it being a 'standard' tech is clearly not completely accurate. However, it can be manufactured and, I'm sure, will be cheaper than using microvias.
Cheers,
Alex
Honored Contributor
