New ContributorI've received few batches of FGPAs from PSG through arrows in jedec trays instead of vacuum packs. What is the risk of storing these parts for the next 24 months ? Is baking a solution for this parts?
ContributorHi Ling Hong,
Thank you for contacting Intel Community. For your information, to confirm if baking required for the parts received must be referring to the devices' Moisture Sensitivity Level (MSL).
The different devices will have different MSL levels. For example, if a device is classified as MSL 1, it is not moisture sensitive and the device does not have to be dry-packed again after the pack has been opened.
You are recommended to refer to the Moisture Sensitivity Level (MSL) webpage in order to know the humidity environment of FPGA:
https://www.intel.com/content/www/us/en/programmable/support/quality-and-reliability/msl.html
Kindly refer to the MSL baking instruction for more details:
Thank you
Regards,
Chia Ling
ContributorHi Ling Hong,
We do not receive any response from you to the answer that I have provided. Please post a response in the next 15 days to allow me to continue to support you. After 15 days, this thread will be transitioned to community support. The community users will be able to help you with your follow-up questions.
Thank you
Regards,
Chia Ling
