FPGAs arrived in jedec trays instead of vacuum pack

Hi Ling Hong,

Thank you for contacting Intel Community. For your information, to confirm if baking required for the parts received must be referring to the devices' Moisture Sensitivity Level (MSL).

The different devices will have different MSL levels. For example, if a device is classified as MSL 1, it is not moisture sensitive and the device does not have to be dry-packed again after the pack has been opened.

You are recommended to refer to the Moisture Sensitivity Level (MSL) webpage in order to know the humidity environment of FPGA:

https://www.intel.com/content/www/us/en/programmable/support/quality-and-reliability/msl.html

Kindly refer to the MSL baking instruction for more details:

https://www.intel.com/content/dam/www/programmable/us/en/pdfs/support/reliability/msl/msl-baking-instruction.pdf

Thank you

Regards,

Chia Ling