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Altera_Forum's avatar
Altera_Forum
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16 years ago

Cyclone III package question about EQFP144

I noticed that the EQFP144 package has an exposed pad on the bottom. I did not account for this in my board layout. How big of a problem is this?
Altera_Forum's avatar
Altera_Forum
Icon for Honored Contributor rankHonored Contributor
16 years ago

Yes, I know, low inductance and high current capability are the same thing when dealing with high frequencies, and my next preproduction run will have a ground pad connected to the ground plane on one of the inside layers by 8 vias.

For now I just want to power up the FPGA so I can discover whether there are any other problems with the design that need immediate fixing before the next revision. Problem is I have the 1.2V rail on a polygon right under the chip so fetching ground will either have to go by a wire to the back or out one of the corners.