Forum Discussion
Hi,
Can you also answer below?
1- What is the failure symptom? Please elaborate the failure symptom in detail.
2.- When did the failure happen?
3.- How did you discover the failure?
4.- In which part of your process did you found the issue (Lab, production, quality, etc.)?
4.1- Was the device already in Field? For how long?
5.- How many units failed and how many units were used/tested by you?
6.- How did you determine the failure? Please elaborate the procedures.
7.- Does the failure unit was ever working before failure? If yes, how long had it been in use?
8.- How did you rule out that the failures were not caused by an electrical over stress (EOS) or an Electrostatic discharge (ESD)?
9.- What are your expectations of this failure analysis?
10.- Have you Re-ball your device? If yes, Is it lead-free reballing?
11.- Please add pictures of the device from the top and the bottom.
Regards,
Aiman
- Junyi_yap1 year ago
New Contributor
Hi @NurAiman_M_Intel ,Hi,
Can you also answer below?
1- What is the failure symptom? Please elaborate the failure symptom in detail.
The only failure symptom is FPGA fail to program during our manufacturing test.
2.- When did the failure happen?
During our manufacturing functional test.
3.- How did you discover the failure?
When we program the FPGA.
4.- In which part of your process did you found the issue (Lab, production, quality, etc.)?
Production
4.1- Was the device already in Field? For how long?
Nope, the FPGA is brand new part.
5.- How many units failed and how many units were used/tested by you?
9 pcs fail out of total 300pcs tested.
6.- How did you determine the failure? Please elaborate the procedures.
The only failure symptom is FPGA fail to program during our manufacturing test.
7.- Does the failure unit was ever working before failure? If yes, how long had it been in use?
Nope, the reject part is constantly fail.
8.- How did you rule out that the failures were not caused by an electrical over stress (EOS) or an Electrostatic discharge (ESD)?
Our production line go through similar process and handle with same method.
9.- What are your expectations of this failure analysis?
Get the Root cause and FA to confirm why the FPGA fail to program.
10.- Have you Re-ball your device? If yes, Is it lead-free reballing?
Nope. There is not needed for re-ball.
11.- Please add pictures of the device from the top and the bottom.
Sorry to said that we already quarantine the reject part and its not possible to pull the part out from quarantine area.