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zxzou
New Contributor
New Contributor5M160ZE64C5N --Minimum Solder voiding acceptance criteria in Thermal plane termination
This criteria related to solder process of SMT(surface mount technology), we would like to know the solder void of big thermal pad minimum acceptance criteria, the x-ray picture shows the sol...
NurAiman_M_Intel
Super Contributor
Super ContributorHi,
Sorry that I missed out to put the link for AN353. Kindly go to the link below:
https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/an/an353.pdf
Let me know your feedback after you have review the AN353.
Thanks.
Regards,
Aiman
