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zxzou's avatar
zxzou
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6 years ago

5M160ZE64C5N --Minimum Solder voiding acceptance criteria in Thermal plane termination

This criteria related to solder process of SMT(surface mount technology), we would like to know the solder void of big thermal pad minimum acceptance criteria, the x-ray picture shows the sol...
NurAiman_M_Intel's avatar
NurAiman_M_Intel
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6 years ago

Hi,


Thank you for contacting Intel community.


Are you referring to process reflow for the FPGA? Kindly refer to

AN 353: SMT Board Assembly Process Recommendations for further info.


Let me know your feedback.


Thanks.


Regards,

Aiman


  • zxzou's avatar
    zxzou
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    6 years ago

    Hi Aiman,

    The material package is QFP, so we can refer to reflow process for QFP,

    is it also applied for this recommendation? not sure if defines solder voiding acceptable criteria.

    by the way, how to get this recommendation of AN 353?