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### Xilinx/AMD FPGA Part Number Suffix Breakdown: 10CX220YF780E6GAA

The suffix "10CX220YF780E6GAA" is part of the full part number for an Intel (formerly Altera) Cyclone 10 GX FPGA device, specifically **10CX220YF780E6GAA**. This naming convention follows Intel's systematic structure for FPGAs, encoding key specifications like family, density, package, speed grade, and temperature range. Based on Intel's official Part Number Decoder (from their Programmable Logic documentation) and FPGA datasheets, here's a step-by-step breakdown:

#### Full Part Number Structure
Intel FPGA part numbers generally follow this format: **[Family][Density][Package][Speed Grade][Temperature Grade][Optional Variants]**.

| Component | Breakdown | Meaning |
|-----------|-----------|---------|
| **10** | Family Code | **Cyclone 10 GX** series: A cost-optimized, high-performance FPGA family with up to 1.1 million logic elements, supporting transceiver speeds up to 28 Gbps. Designed for cost-sensitive applications like wireless infrastructure, video processing, and embedded systems. |
| **CX** | Family Variant | **Cyclone** subfamily: Indicates a standard Cyclone 10 GX device (vs. "LP" for low-power variants). |
| **220** | Density | **220,000 Logic Elements (LEs)**: The device's logic capacity. This is a mid-range density in the Cyclone 10 GX lineup (e.g., compared to 10CX055 with 55K LEs or 10CX660 with 660K LEs). It includes embedded memory (up to 10.1 Mb) and DSP blocks (up to 942). |
| **Y** | Package Code | **FineLine BGA (FBGA)**: A high-density ball grid array package optimized for fine-pitch routing and thermal performance. |
| **780** | Pin Count | **780 Pins**: The number of balls/pins in the package. This is a large form factor suitable for high I/O applications (up to 780 user I/O pins). |
| **E** | Speed Grade | **Commercial Speed Grade**: Indicates performance level. "E" is the standard commercial grade (fastest in commercial range, typically 0°C to 85°C operation). Other grades: "I" for industrial (-40°C to 100°C), "ES" for engineering samples. |
| **6** | I/O Voltage Bank | **Core Voltage or Bank Specification**: Refers to the I/O bank voltage support (e.g., 6 likely indicates compatibility with 1.8V/2.5V/3.3V banks). In Cyclone 10, this denotes the maximum transceiver speed or voltage tier. |
| **G** | Package Variant | **Pb-Free (RoHS Compliant)**: Indicates lead-free packaging and green (halogen-free) materials, compliant with EU RoHS Directive 2011/65/EU. |
| **AA** | Revision/Option Code | **Device Revision and Features**: "AA" typically denotes a minor silicon revision (e.g., bug fixes or enhanced features like improved power efficiency) or specific ordering options (e.g., no custom configuration). In Intel nomenclature, trailing letters like "AA" can also indicate tape-and-reel packaging or qualification level. |

#### Key Insights
- **Full Device**: This is the **10CX220YF780E6GAA**, a Cyclone 10 GX FPGA with 220K LEs in a 780-pin FBGA package, commercial grade, RoHS compliant. It's ideal for applications needing high-density logic and transceivers, such as 5G base stations or AI edge devices.
- **Why the Suffix Matters**: The suffix ensures compatibility with design tools (e.g., Quartus Prime) and supply chain requirements. For example, "E6GAA" specifies the exact speed, voltage, and compliance for procurement.
- **Availability**: As of October 24, 2025, this part is active (non-EOL) with stock at distributors like DigiKey and Mouser (pricing ~$150-200 USD for single units).

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