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BD28's avatar
BD28
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4 years ago

Delidding FPGA

Currently, I am attempting to perform an DPA on the the Intel Altera Aria 10 GX FPGA. I have ran into an issue during the delidding process, which is the thermal expoxy cauisng a strong bond between the heatspreader and board. I am seeking information to delidd the component without damaging internal components, is there a process that exists or person that can be contacted?

8 Replies

  • NurAiman_M_Intel's avatar
    NurAiman_M_Intel
    Icon for Super Contributor rankSuper Contributor
    4 years ago

    Hi,


    I am checking this with my internal team. Will be back for further information.


    Regards,

    Aiman


    • BD28's avatar
      BD28
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      4 years ago

      Aiman,

      Has your team provided any additional information?

      BD

  • NurAiman_M_Intel's avatar
    NurAiman_M_Intel
    Icon for Super Contributor rankSuper Contributor
    4 years ago

    Hi,


    Additional question, please explain what is DPA and why do you need to do it? Please note that once the device has been delidded, the warranty of the device is voided.


    Regards,

    Aiman


    • BD28's avatar
      BD28
      Icon for New Contributor rankNew Contributor
      4 years ago

      Destructive Physical Analysis, This in order to confirm that device construction and design aligns with the standards for use in different applications and enviroments, that require high reliability.

      BD

  • NurAiman_M_Intel's avatar
    NurAiman_M_Intel
    Icon for Super Contributor rankSuper Contributor
    4 years ago

    Hi,


    The delidding process is as follow:


    • Heat the device/lid to about 100C. This will soften the lid attachment epoxy and the thermal interface material (TIM). Make sure the temperature is maintained as this will soften the TIM and lid attachment epoxy.
    • Using an exactor knife or blade, slide the lid open along the lid to substrate interface.


    Again, please be noted that once the lid is removed, the warranty of the device is voided. There will be no further support from Intel.


    Regards,

    Aiman


  • NurAiman_M_Intel's avatar
    NurAiman_M_Intel
    Icon for Super Contributor rankSuper Contributor
    4 years ago

    Hi,


    The delidding process is as follow:


    • Heat the device/lid to about 100C. This will soften the lid attachment epoxy and the thermal interface material (TIM). Make sure the temperature is maintained as this will soften the TIM and lid attachment epoxy.
    • Using an exactor knife or blade, slide the lid open along the lid to substrate interface.


    Again, please be noted that once the lid is removed, the warranty of the device is voided. There will be no further support from Intel.


    Regards,

    Aiman


  • NurAiman_M_Intel's avatar
    NurAiman_M_Intel
    Icon for Super Contributor rankSuper Contributor
    4 years ago

    Hi,


    The delidding process is as follow:


    • Heat the device/lid to about 100C. This will soften the lid attachment epoxy and the thermal interface material (TIM). Make sure the temperature is maintained as this will soften the TIM and lid attachment epoxy.
    • Using an exactor knife or blade, slide the lid open along the lid to substrate interface.


    Again, please be noted that once the lid is removed, the warranty of the device is voided. There will be no further support from Intel.


    Regards,

    Aiman