Forum Discussion

BD28's avatar
BD28
Icon for New Contributor rankNew Contributor
4 years ago

Delidding FPGA

Currently, I am attempting to perform an DPA on the the Intel Altera Aria 10 GX FPGA. I have ran into an issue during the delidding process, which is the thermal expoxy cauisng a strong bond between ...
NurAiman_M_Intel's avatar
NurAiman_M_Intel
Icon for Super Contributor rankSuper Contributor
4 years ago

Hi,


The delidding process is as follow:


  • Heat the device/lid to about 100C. This will soften the lid attachment epoxy and the thermal interface material (TIM). Make sure the temperature is maintained as this will soften the TIM and lid attachment epoxy.
  • Using an exactor knife or blade, slide the lid open along the lid to substrate interface.


Again, please be noted that once the lid is removed, the warranty of the device is voided. There will be no further support from Intel.


Regards,

Aiman