Forum Discussion
BD28
New Contributor
5 years agoDelidding FPGA
Currently, I am attempting to perform an DPA on the the Intel Altera Aria 10 GX FPGA. I have ran into an issue during the delidding process, which is the thermal expoxy cauisng a strong bond between ...
NurAiman_M_Intel
Super Contributor
5 years agoHi,
I am checking this with my internal team. Will be back for further information.
Regards,
Aiman
BD28
New Contributor
5 years agoAiman,
Has your team provided any additional information?
BD