--- Quote Start ---
I personally recommend tenting the vias, and placing decoupling capacitors on every single power via.
--- Quote End ---
Just to follow this up, if you're using devices with 1mm BGA pitch then a footprint for 0402 caps can be created with round pads with 1mm centres.
On the back of the board these mirror the BGA pads on the top of the board and allow you to connect straight to the vias from the top layer.
This _almost_ makes the cap placement easy (though it's always a bit of a jigsaw).
My assembly guy prefers these round 0402 pads to the previous 'standard' ones I was using so they have become my default 0402 footprint.
Nial
Honored Contributor
