Thermal properties change from Altera P/N EP2AGX45DF25I3N (EOL) to EP2AGX45DF25I3G.

Question

We are evaluating the change from Altera P/N EP2AGX45DF25I3N (EOL) to EP2AGX45DF25I3G.

The spec for EP2AGX45DF25I3N is lidless, and EP2AGX45DF25I3G is molded thermal composite. The data from the website only shows a single set of numbers for the part family. Can you confirm that there is no difference in thermal properties for the two devices?

jonway_altera · Answer

Hi DBohr1The only difference is the suffix "G".And the reason for changing N to G is due to RoHS (fully lead free).https://www.intel.la/content/dam/www/programmable/us/en/pdfs/literature/pcn/pdn1926.pdfEverything else is the same.

jonway_altera · Answer

Correction to previous:The molded has slightly a bigger surface area. Logically, thermally should not affect much. For dimension details you can refer to:https://www.intel.com/content/www/us/en/programmable/support/literature/lit-index/lit-pkg/package.html?family=Arria_II

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Thermal properties change from Altera P/N EP2AGX45DF25I3N (EOL) to EP2AGX45DF25I3G.

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