Forum Discussion
Altera_Forum
Honored Contributor
12 years agoI'm not sure what you are asking about. You may use two reflow cycles of a board in double side assembly, but FPGAs would be usually placed in the second cycle. In rework, you don't reflow solder a complete board.
Most FPGAs are moisture sensitive devices and must be baked before soldering when exposed longer than 2 to 7 days (depending on the sensitivity level) to ambient air.