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SL10's avatar
SL10
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5 years ago

Reflow profile, time above liquidous temperature

We found that field return units have cracked solder ball all at the ball/IC substrate interface for EPM570F256I5. Reflow profile review shows that the TL (time above liquidous temperature) was...
BG-10649's avatar
BG-10649
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3 years ago

Hello,

We have similar issue with soldering component 10CL055YF484I7G on an 8 layer PCB. Can you provide more information regarding the correction that you have proposed?

Best Regards,

Kiril Ivanov

[email protected]