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SL10's avatar
SL10
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4 years ago

Reflow profile, time above liquidous temperature

We found that field return units have cracked solder ball all at the ball/IC substrate interface for EPM570F256I5. Reflow profile review shows that the TL (time above liquidous temperature) was...
NurAiman_M_Intel's avatar
NurAiman_M_Intel
Icon for Super Contributor rankSuper Contributor
4 years ago

Hi,


Thank you for contacting Intel community.


Kindly share the picture of the cracked solder ball for further advise.


Thanks.


Regards,

Aiman


SL10's avatar
SL10
Icon for New Contributor rankNew Contributor
4 years ago

Examples of cracked solder balls show below (BGA on TOP side):

Thanks