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khagesh1010's avatar
khagesh1010
Icon for New Contributor rankNew Contributor
2 years ago

Reflow Process recommendations of FPGA Agilex (AGFB012R24B2I3E)

Dear Intel team,

We would like to know technical info of FPGA Agilex (AGFB012R24B2I3E)

- Solder paste opening recommendation
- Reflow profile
- Life cycle time like how many time reflow and reheat and reballing can be done.

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Khagesh

2 Replies

  • NazrulNaim_Intel's avatar
    NazrulNaim_Intel
    Icon for Regular Contributor rankRegular Contributor
    2 years ago

    Hello,


    Sorry for the delay. To answer your request. For reflow profile, we follow the Industrial Standard – IPC/JEDEC: J-STD 020E or newer.

    Regards,

    Nazrul Naim


  • NazrulNaim_Intel's avatar
    NazrulNaim_Intel
    Icon for Regular Contributor rankRegular Contributor
    2 years ago

    Hi,


    As we do not receive any response from you on the previous question/reply/answer that we have provided, please login to ‘https://supporttickets.intel.com’, view details of the desire request, and post a feed/response within the next 15 days to allow me to continue to support you. After 15 days, this thread will be transitioned to community support. The community users will be able to help you on your follow-up questions.


    Regards,

    Nazrul Naim