Occasional ContributorDear Intel team,
We would like to know technical info of FPGA Agilex F Tile (AGFA027R31C2E2V)
- Pad recommendations
- Solder paste opening recommendation
- Reflow profile.
Thanks in advance
RR
Regular ContributorHi RSang,
You may take a look and see if this is applicable:
Intel® Agilex™ FPGAs and SoCs Device Overview
F-tile Architecture and PMA and FEC Direct PHY IP User Guide
Regards,
Fakhrul
Occasional ContributorDear Fakhrul,
Thank you for information.
We couldn't find the required 3topic in the document. Can you share to us the the document of the topic below?
- Pad recommendations
- Solder paste opening recommendation
- Reflow profile.
Regards,
RSang.
Regular ContributorHi RSang,
Thank you for reaching out. Allow me some time to look into your issue. I shall come back to you with findings.
Thank you for your patience.
Best Regards,
Nazrul Naim
Regular ContributorHello,
I'm still in the midst of the discussion regarding this with the internal teams. Unfortunately, it takes longer than usual . I will plan on letting you know as soon as I learn more information.
Really appreciate your patience.
Warm Regards,
Nazrul Naim
Regular ContributorHello,
For the request of the process recommendations. Below I have attach a file where all the information needed are in there.
Thank you for your patience.
Regards,
Nazrul Naim
Regular ContributorHi,
As we do not receive any response from you on the previous question/reply/answer that we have provided, please login to ‘https://supporttickets.intel.com’, view details of the desire request, and post a feed/response within the next 15 days to allow me to continue to support you. After 15 days, this thread will be transitioned to community support. The community users will be able to help you on your follow-up questions.
Regards,
Nazrul Naim
Occasional ContributorDearNazrul,
Thank you very much for sharing this information
Regards,
Rungruang
