Forum Discussion
Nakaj
New Contributor
1 year agoMAX V Exposed pad solder reflow problem
A reflow soldering failure occurred on the exposed pad on the bottom of the QFP64 pin device of the MAX V device. Please let me know if there is a recommended pattern layout for Exposed Pad. Plea...
- 1 year ago
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FakhrulA_altera
Regular Contributor
1 year agoHi Nakaj,
You can refer to AN 353: SMT Board Assembly Process Recommendations, and check the rework section where all the requirements are mentioned. I’ve looked through our internal documents, and this is the best information we have available.
Regards,
Fakhrul