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Nakaj's avatar
Nakaj
Icon for New Contributor rankNew Contributor
1 year ago
Solved

MAX V Exposed pad solder reflow problem

A reflow soldering failure occurred on the exposed pad on the bottom of the QFP64 pin device of the MAX V device. Please let me know if there is a recommended pattern layout for Exposed Pad. Plea...
Board Debug
  • FakhrulA_altera's avatar
    FakhrulA_altera
    1 year ago

    Thanks for your response, I now transition this thread to community support. This thread will be transitioned to community support. If you have a new question, feel free to open a new thread to get support from Intel experts. Otherwise, the community users will continue to help you on this thread. Thank you.


FakhrulA_altera's avatar
FakhrulA_altera
Icon for Regular Contributor rankRegular Contributor
1 year ago

Hi Nakaj,


Apologies for the delay due to the end-year and New Year holidays. As mentioned in the AN353, you may refer to the latest IPC-A-610D Standard.


Regards,

Fakhrul


Nakaj's avatar
Nakaj
Icon for New Contributor rankNew Contributor
1 year ago

Thank you so much for your reply.

But my question is still not resolved.

Please tell me the temperature and heating time of the heater when removing the IC. How can I evaluate the effect on the circuit components on the back side of the IC to be removed?

Regards

Nakaj